Call Us: 858-385-1958 - Email: info@pacificxray.com
Pacific Xray Imaging

FAILURE ANALYSIS

QFN-image3solder-mis-registration-3d-image1Plated-through-hole-PTH-barrel-fill-image1Discrete-component-voids

Failure Analysis can be accomplished with the GenX series systems over a broad range of components, devices and assemblies.

The simple ease of use features in the GenX series systems provide quick and detailed information that can be useful in design development as well as basic RMA return failure analysis cases.

Back to Top