BGA INSPECTION Large voids can be easily seen in the BGA ball joints using the GenX series x-ray systems. Off axis / compound angle capability with the Gen-X Series Systems can check for proper solder ball reflow by inspecting and measuring shape and size of the BGA ball joints. Sample x-ray image of non eutectic solder ball and its attachments to the bottom board pad and top component joint. Example of oblique angle image of BGA solder ball joints showing inconsistent ball size and shape which is indicative of poor reflow. Void locations within the ball joints can also be seen. Overview of BGA solder ball joints showing excessive voiding, inconsistent size and shape which is a result of poor reflow.